From Principia Labs, 1 year ago,
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A brief non-scientific summary:
Two non-functional headsets, one diagnosed as a solder disconnect at the earpiece speaker (HS1); and one diagnosed as a possible broken wire inside the insulation near the earpiece (HS2).
The moulding for the earpiece on HS1 was damaged during dissection. The moulding for HS2 was removed and transferred to HS1, after re-solder the earpiece was still non-functional.
The wire to the earpiece of HS1 was trimmed to a point before the suspected wire damage inside the insulation and then soldered to the speaker. The earpiece was functional. It was then noted that the earpiece moulding had not been assembled prior to soldering, a necessary step. The speaker was de-soldered, moulding assembled, and the wire was again soldered to the speaker. The headset is now functional.
The assembly for HS2 is available for a future project involving a complete speaker and earpiece replacement. This would involve grafting an earpiece (from a stereo headset) assembly to t ...
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